ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,747, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Opossum redistribution frame for configurable memory devices"... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,747, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Opossum redistribution frame for configurable memory devices"... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,748, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Capacitor pads and methods of manufacturing the same" was inv... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,748, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Capacitor pads and methods of manufacturing the same" was inv... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,749, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Kyu... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,749, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Kyu... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,751, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,751, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,752, issued on April 14, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor die package" was invented by ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,752, issued on April 14, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor die package" was invented by ... Read More